Hybrid architecture for zero border display

ABSTRACT

Hybrid architectures and method methods of operating a display panel are described. In an embodiment, row driver and pixel driver functions are combined in a group of backbone hybrid pixel driver chips, wherein global signal lines are distributed to the backbone hybrid pixel driver chips, where the global signals are manipulated and distributed to a row of pixel driver chips.

RELATED APPLICATIONS

This application is a continuation of co-pending U.S. patent applicationSer. No. 17/727,197, filed Apr. 22, 2022, which is a continuation ofU.S. application Ser. No. 17/088,809, filed Nov. 4, 2020, now U.S. Pat.No. 11,341,893 which is a continuation of U.S. patent application Ser.No. 16/356,914, filed Mar. 18, 2019, now U.S. Pat. No. 10,854,129, whichclaims priority to U.S. Provisional Application No. 62/686,297 filedJun. 18, 2018. Both U.S. patent application Ser. No. 16/356,914 and U.S.Provisional Application No. 62/686,297 are incorporated herein byreference.

BACKGROUND Field

Embodiments described herein relate to a display system, and morespecifically to passive matrix displays and methods of operation.

Background Information

Display panels are utilized in a wide range of electronic devices.Common types of display panels include active matrix display panelswhere each pixel element, e.g. light emitting diode (LED), may beindividually driven to display a data frame, and passive matrix displaypanels where rows and columns of pixel elements may be driven in a dataframe. Both active and passive matrices have been proposed for thefabrication of tiled displays, where display panel dimensions are largerthan the limitations imposed on substrate and equipment sizerestrictions.

SUMMARY

Hybrid architecture display panels and methods of operation aredescribed. In embodiment, a display panel includes a bus column ofglobal signal lines, a plurality of rows of row function signal lines,and a plurality of rows of pixel driver chips, each row of pixel driverchips connected to a corresponding row of row function signal lines,each pixel driver chip connected to a corresponding matrix of lightemitting diodes (LEDs). Each row of pixel driver chips can include agroup of backbone hybrid pixel driver chips and a group of LED drivingpixel driver chips. The bus column of global signal lines is coupled tothe group of backbone hybrid pixel driver chips for each row of pixeldriver chips and each separate backbone hybrid pixel driver chipincludes an input connected to a corresponding global signal line and anoutput connected to a corresponding row function signal line within acorresponding row of row function signal lines to transmit acorresponding manipulated signal to the corresponding row of pixeldriver chips.

In an embodiment, a hybrid pixel driver chip includes a VST drivercircuity to determine whether the particular row is on or off, and topropagate VST signals from the top to bottom of the display panel. Inaddition, the hybrid pixel drive chip includes a signal modulatorcircuitry to select whether to use a global row function signal line orbackup line input, and transmit an internal signal to a multiplexerdriver circuitry, which generates a manipulated row function signal.Additionally, the hybrid pixel drier chips include LED driving circuitry1460 to drive a corresponding matrix of LEDs. Thus, the hybrid pixeldriver chips include a hybrid architecture to support row driverfunctions and pixel driver functions.

In an embodiment, a method of programming a display includes propagatingVST signals to a row of pixel driver chips, receiving token driverconfiguration data with a backbone hybrid pixel driver chip, receiving aglobal configuration update pulse with the backbone hybrid pixel driverchip, receiving row driver configuration data with the token activatedbackbone hybrid pixel driver chip, and transmitting a manipulatedconfiguration update signal from the backbone hybrid pixel driver chipto the row of pixel driver chips.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is schematic top view illustration of a local passive matrixdisplay including rows of hybrid pixel driver chips in accordance withan embodiment.

FIG. 2 is a schematic diagram of a matrix of light emitting diodes(LEDs) coupled with terminals of a hybrid pixel driver chip inaccordance with an embodiment.

FIG. 3 is a schematic diagram of a matrix of redundant pairs of LEDsbeing driven by redundant pairs of hybrid pixel driver chips inaccordance with an embodiment.

FIG. 4 is schematic top view illustration of a tile-based display panelwith a cut-out and spline-corners in accordance with an embodiment.

FIG. 5A is schematic top view illustration of a tile-based displayincluding tile backbones of hybrid pixel driver chips that serve as rowdrivers in accordance with an embodiment.

FIG. 5B is schematic top view illustration of a display tile partitionof the display of FIG. 5A from a data and configuration updateperspective in accordance with an embodiment.

FIG. 6 is a routing diagram of row-function partitioning within a hybridpixel driver chip backbone in accordance with an embodiment.

FIG. 7 is a layout diagram of row control signal redundancy and backupwithin a hybrid pixel driver chip backbone in accordance with anembodiment.

FIG. 8 is a routing diagram of emission frame synchronization andemission row synchronization buffering within rows of pixel driver chipsin accordance with an embodiment.

FIG. 9 is a routing diagram of vertical signal redundancy and emissionclock vertical and horizontal buffering in accordance with anembodiment.

FIG. 10 is a routing diagram of backbone routing of global signal linesto rows of hybrid pixel driver chips and row signal lines in accordancewith an embodiment.

FIG. 11 is a routing diagram of horizontal control signal redundancy forVST and backup line connection in accordance with an embodiment.

FIG. 12 is a routing diagram of horizontal control signal redundancy forrow function signal connections in accordance with an embodiment.

FIG. 13 is a routing diagram of global signal lines and row signal linesconnections to and from the backbone of a tile-based display panel inaccordance with an embodiment.

FIG. 14 is a block circuit diagram for a backbone hybrid pixel driverchip in accordance with an embodiment.

FIG. 15 is a timing diagram for data loading of token activated hybridpixel driver chips in accordance with an embodiment.

FIG. 16 is a flow chart for a method of programming a display tile fromreset in accordance with an embodiment.

DETAILED DESCRIPTION

Embodiments describe hybrid architectures and method methods ofoperating a display panel in which row function circuitry and pixeldriving function circuitry are combined in a backbone of hybrid pixeldriver chips. In this manner total silicon chip area can be reduced withelimination of specified row driver chips. In addition, the arrangementfacilitates the fabrication of tile-based display panel arrangementswith configurable sizes and shapes, and reduced borders, or zeroborders, where areas traditionally reserved for driver ledges may beomitted.

In some embodiments the tile-based display panels may include anarrangement of pixel driver chips to drive local matrices of pixels in alocal passive matrix (LPM). Compared to direct drive approach, whereevery pin of the pixel driver is connected to one LED, the LPMarrangements in accordance with embodiments may significantly reduce thesilicon area associated with the pixel drivers, and the panel peak panelcurrent. In some embodiments the pixel driver chips are distributedbetween LEDs. Such a configuration may include pixel driver chips beinglaterally between LEDs on the same side of the display substrate.Depending upon complexity, the pixel driver chips may be longer than thecorresponding LED matrices they control (e.g. wider than row length of acorresponding matrix). As a result, the pixel driver chips may bestaggered, for example, in zigzag patterned rows. It is not requiredthat the pixel driver chips be mounted on the same surface as the LEDs,or between the LEDs. In accordance with all embodiments described hereinthe pixel driver chips may also be located within the display substrate,and may be positioned face up (e.g. with terminals facing up towards theLEDs), positioned face down (e.g. with terminals facing away from theLEDs), or both (with terminals on both top and bottom sides). Thus,where the pixel driver chips are described herein as being distributedabout a display area, or interspersed with a display area, it isunderstood the pixel driver chips may be on the display substrate (e.g.surface mounted) or embedded within the display substrate. In accordancewith all embodiments described herein the pixel driver chips may beadjacent a corresponding plurality of pixels. Likewise, this includesconfigurations of both pixel drivers chips on or within the displaysubstrate, where the pixel driver chips are adjacent to LEDs on thedisplay substrate. The tile-based LPM displays in accordance withembodiments may be implemented in both large area displays, as well ashigh resolution displays with high pixel density. Furthermore, LED andpixel driver chip sizes are scalable from macro to micro sized. In anembodiment, the pixel driver chips may have a maximum dimension of lessthan 200 μm, or even less than 100 μm, with LED maximum dimensions ofless than 100 μm, or even less than 20 μm, such as less than 10 μm, oreven less than 5 μm for displays with high resolution and pixel density.

In various embodiments, description is made with reference to figures.However, certain embodiments may be practiced without one or more ofthese specific details, or in combination with other known methods andconfigurations. In the following description, numerous specific detailsare set forth, such as specific configurations, dimensions andprocesses, etc., in order to provide a thorough understanding of theembodiments. In other instances, well-known techniques and componentshave not been described in particular detail in order to notunnecessarily obscure the embodiments. Reference throughout thisspecification to “one embodiment” means that a particular feature,structure, configuration, or characteristic described in connection withthe embodiment is included in at least one embodiment. Thus, theappearances of the phrase “in one embodiment” in various placesthroughout this specification are not necessarily referring to the sameembodiment. Furthermore, the particular features, structures,configurations, or characteristics may be combined in any suitablemanner in one or more embodiments.

FIG. 1 is schematic top view illustration of a local passive matrixdisplay 100 including rows [1, 2, . . . N] of pixel driver chips 110 inaccordance with an embodiment. Each pixel driver chip 110 may includetwo portions or slices 0, 1 for operation of pixel matrices 102 aboveand under the pixel driver chip 110. The slices 0, 1 may be separatedinto primary/redundant configurations, or master/slave configurations.Each matrix 102 may include a plurality of LEDs 104 and a plurality ofpixels 106. In some configurations, the rows of pixel driver chips 110are arranged in rows with every other row being a row of primary pixeldriver chips (e.g. row 1, 3, etc.) or row of redundant pixel driverchips 110 (e.g. row 2, 4, etc.). It is to be appreciated that the numberand size of the pixel driver chips 110 within the display area 105 isnot necessarily drawn to scale, and is enlarged for illustrationalpurposes.

Generally, the local passive matrix display 100 may include a displaysubstrate 101, a display area 105, optional column drivers or signalline driving circuits, and an external control circuit 140 that isattached with the display substrate 101 to supply various controlsignals, video signals, and power supply voltage to the displaysubstrate 101.

Referring now to FIG. 2 , a schematic diagram of a matrix 102 of lightemitting diodes (LEDs) coupled with terminals of a pixel driver chip isprovided in accordance with an embodiment. In an embodiment, a localpassive matrix display includes a pixel driver chip 110, a plurality ofpixels 106 arranged in a plurality of display rows, and a plurality ofterminals 111 of the pixel driver chip 110 coupled with the LEDs 104 ofthe plurality of pixels 106. As shown in FIG. 2 , a portion of theterminals 111 are coupled with corresponding row-line switches and levelshifters within the pixel driver chip 110 and corresponding rows of LEDs104, and a portion of the terminals 111 are coupled with output drivers116 of the pixel driver chip 110 and corresponding columns of LEDs 104.For example, interconnects 112 may connect to electrodes (e.g. cathodes)of a row of LEDs 104 to corresponding row-line switches and levelshifters, while interconnects 114 may connect electrodes (e.g. anodes)of a column of LEDs 104 to corresponding output drivers 116, orvice-versa. The particular embodiment illustrated in FIG. 2 illustratesas matrix 102 of LEDs 104 connected to a portion of the pixel driverchip 110, and more specifically to “slice 1” of the pixel driver chip110. Similar connections may also be provided for the second portion, or“slice 0”, of the pixel driver chip 110. It is to be appreciated, thatusage of the term “slice” is simplified, and in no way suggests ageometric split of circuitry within the pixel driver chips 110, andinstead is a simplistic reference to top and bottom connections in theillustration. Additionally, the particular selection of eight rows andsix columns of LEDs within a matrix is exemplary, and embodiments arenot so limited.

In an embodiment, a first terminal 111A of the pixel driver chip 110 iscoupled with a first row of light emitting diodes (LEDs) 104 of theplurality of pixels, a second terminal 111B of the pixel driver chip 110is coupled with a second row of LEDs of the plurality of pixels, and athird terminal 111C is coupled with a first column of LEDs of theplurality of pixels, the first column of LEDs including a first LED ofthe first string (e.g. row) of LEDs and a first LED of the second string(e.g. row) of LEDs. A fourth terminal 111D is coupled with a secondcolumn of LEDs of the plurality of pixels, the second column of LEDsincluding a second LED of the first string of LEDs and a second LED ofthe second string of LEDs. As shown, the third terminal may be coupledwith a first output driver 116 of the pixel driver chip, and the fourthterminal coupled with a second output driver 116 of the pixel driverchip. As shown in FIG. 1 , the pixel driver chip 110 may be in a row ofpixel driver chips in a line across the display substrate. In otherembodiments, the row of pixel driver chips may be curved along thedisplay area of the display substrate.

In the embodiment illustrated, the rows of LEDs 104 correspond todifferent emission colors of LEDs, such as red (R), green (G), blue (B)in an RGB pixel arrangement. Alternative pixel arrangement may also beused.

FIG. 3 is a schematic diagram of a matrix of redundant pairs of LEDsbeing driven by redundant pairs of pixel driver chips in accordance withan embodiment. FIG. 3 illustrates a matrix 102 similar to thatillustrated in FIG. 2 , with the addition of redundant LEDs 104 withinthe pixels 106. In such an embodiment, a portion (slice 1) of pixeldriver chip 110 N-1 includes terminals 111 coupled with the LEDs 104,similar as described with regard to FIG. 2 . In addition, within thesame matrix 102, a portion (slice 0) of pixel driver chip 110 N, e.g. inthe next row of pixel driver chips, is also similarly coupled withredundant LEDs 104, with separate interconnects 112, 114. In thismanner, providing separate anode and separate cathode contacts for pixeldriver chip N-1 and pixel driver chip N can prevent timing conflictbetween the primary and pixel driver portions (e.g. slice 0, slice 1)associated with the same matrix 102.

In an embodiment, such as that illustrated in FIG. 3 , separate cathodescan be provided for primary and redundant portions, or slices, of thepixel driver chips 110. In one method of operation, half of the pixeldriver chips 110 (e.g. primary pixel driver chips 110) are active bydefault. Thus, every other row of pixel driver chips 110 is active. TheLEDs 104 coupling with the pixel driver chips 110 may also be staggered,for example, to mitigate visual artifacts.

In some embodiments, a master portion, or slice 0, of each pixel driverchip is default active for each pixel driver chip, and the slaveportion, or slice 1, of each pixel driver chip is default inactive.Thus, a slave or redundant portion only becomes active if a master orprimary portion from an adjacent pixel driver chip is defective, orinactive. In some embodiments, both portions or slices 0, 1 of a primarypixel driver chip are default active, while the corresponding portionsor slices 0, 1 of a redundant pixel driver chip are default inactive.Thus, a portion, or whole, of a redundant pixel driver chip only becomesactive if an adjacent primary pixel driver chip portion is defective, orinactive. In accordance with embodiments, the arrangements of LEDmatrices, pixel driver chips, and redundancy configurations, may resultin particular LED emission progressions in operation of the displaypanel.

FIG. 4 is schematic top view illustration of a tile-based display panelwith a cut-out 530 and spline-corners in accordance with an embodiment.In particular, the arrangement of pixel driver chips 110 in accordancewith embodiments can remove the requirement for driver ledges on theedges of a display panel. As a result, the display substrates 101 mayhave reduced borders, or zero borders outside of the display area. Theconfiguration may facilitate the formation of display panels with curvededges, as well as cutouts 530. In addition, the configuration mayfacilitate modular arrangements, including micro arrangements, ofdisplay tiles 410. Generally, the control circuit 140 may be coupled toan edge of the display substrate 101. Bus columns 515 of global signallines may extend from the control circuit 140 to supply global signalsto the display panel. For example, the global signal lines may includeat least data clock lines 510 and emission clock lines 520. The globalsignal lines are coupled to a plurality of “hybrid” pixel driver chips,and together form a backbone of the display, or display tile 410. Thecorresponding backbone hybrid pixel driver chips receive the globalsignals and then transmit manipulated signals to their correspondingrows 404 of row signal lines connected to the other pixel driver chips110 within the same row. For example, the global data clock and emissionclock signals may be converted to manipulated signals and transmitted tothe row of pixel driver chips 110 along manipulated data clock lines510M and manipulated emission clock lines 520M. For example, themanipulated signals may include only the necessary information for theparticular row.

The tile-based display panels in accordance with embodiments may havevarious arrangements of display tiles 410. For example, the displaytiles 410 may be arranged side-by-side (horizontally), stacked(vertically), both, as well as other configurations. Additionally, thebus columns 515 of global signal lines may be aligned and connected forstacked display tiles 410.

FIG. 5A is schematic top view illustration of a tile-based displayincluding tile backbones 402 of hybrid pixel driver chips that serve asrow drivers in accordance with an embodiment. FIG. 5B is schematic topview illustration of a display tile partition of the display of FIG. 5Afrom a data and configuration update perspective in accordance with anembodiment. The display in accordance with embodiments may include adisplay panel including a plurality of tiles 410. The tiles 410 may beformed from the same or multiple display substrates 101. The controlcircuit 140 of FIG. 1 may be mounted on a printed circuit board 430connected to the display substrate 101 with a flex circuit, or chip onfilm 432, for example. Bus columns 515 and data lines 440 may extendfrom the control circuit to the display substrate 101. Column drivers430 may optionally be located on the display substrate 101 to buffer theglobal signal lines in the bus columns 515 and/or data lines 440. Eachtile 410 may include one or more bus columns 515 of global signal lines,a plurality of rows 404 of row function signal lines, and a plurality ofrows of pixel driver chips 110, with each row of pixel driver chips 110connected to a corresponding row 404 of row function signal lines.Additionally, each pixel driver chip 110 is connected to correspondingmatrices 102 of LEDs 104 as described with regard to FIGS. 1-3 .

As shown in FIG. 5B, each row of pixel driver chips 110 includes a groupof backbone hybrid pixel driver chips 110B and a group of LED drivingpixel driver chips 110D. The routing of the bus columns 515 and backbonehybrid pixel driver chips 110B may form a backbone 402 of the tiles 410.Each of the backbone hybrid pixel driver chips 110B and LED drivingpixel driver chips 110D may be hybrid pixel driver chips, onlyconfigured differently for different function. Alternatively, chips110B, 110D may have different internal circuitries. The backbone hybridpixel driver chips 110B and LED driving pixel driver chips 110D mayadditionally be connected differently. In accordance with embodiments,each of the backbone hybrid pixel driver chips 110B and LED drivingpixel driver chips 110D are connected to corresponding matrices 102 ofLEDs 104 as described with regard to FIGS. 1-3 .

In accordance with embodiments, the bus column 515 of global signallines is coupled to the group of backbone hybrid pixel driver chips 110Bfor each row of pixel driver chips 110 and each separate backbone hybridpixel driver chip 110B includes an input connected to a correspondingglobal signal line (e.g. 622, 621, 614, 613, 605, 680, 681) and anoutput connected to a corresponding row function signal line (e.g. 613M,614M) within a corresponding row 404 of row function signal lines totransmit a corresponding repeat global signal to the corresponding rowof pixel driver chips 110.

As shown specifically in FIG. 5B, and described in further detail in thefollowing description, exemplary global signal lines forming the buscolumns 515 may include global data clock_0 622, global data clock_1621, hybrid driver configuration update_0 614, global configurationupdate_1 613, vertical selection token (VST) 605, vertical selectiontoken scan clock 680, and vertical selection token row capture clock681, amongst others. In this context, distinction of signal lines 0/1 ismade due to adjacent pairs of pixel driver chips 110 sharing a commondata 440 line. Thus, the same data signals may be sent to two pixeldriver chips 110 within the same row, with the global signal lines usedto distinguish the pair. In particular, the backbone hybrid pixel driverchips 110B in accordance with embodiments are configured to receive aspecified global signal, and then transmit a manipulated row functionsignal (e.g. the global signal is manipulated to form the manipulatedrow function signal) to a corresponding row 404 of row function signallines that is coupled to the corresponding row of hybrid pixel driverchips 110, including the plurality of LED driving pixel driver chips110D and one or more of the other backbone hybrid pixel driver chips110B within the row of pixel driver chips.

FIG. 6 is a routing diagram of row-function partitioning within a hybridpixel driver chip backbone in accordance with an embodiment. It is to beappreciated, the connections illustrated in FIG. 6 illustrate generalhigh level partitioning, and actual implementations may be more complex.As shown, the bus column 515 of global signal lines may include a globalconfiguration update 610, global data clock 620, global emission rowsynchronization 630, and global emission frame synchronization 640.Global emission clock lines may also be included. Additionally, emissionclocks may be combined for different color emitting LEDs in someembodiments, though this is not required. For example, there may be aglobal emission clock red 650 and global emission clock blue-green 660.A respective backbone hybrid pixel driver chip 110B may then transmit amanipulated row signal 610M-660M to the corresponding row 404 of rowsignal lines. These manipulated row signals 610M-660M may be transmittedso some or all of the other backbone hybrid pixel driver chips 110B, aswell as to the LED driving pixel driver chips 110D in the correspondingrow of pixel driver chips 110. As will become apparent in the followingdetailed examples, the global signal lines may additionally includeodd/even indices 1/0 or primary/redundant signal lines.

FIG. 7 is a layout diagram of row control signal redundancy and backupwithin a hybrid pixel driver chip backbone in accordance with anembodiment. As shown, the row of hybrid pixel driver chips 110, and row404 of row signal lines may be partitioned into odd and even indices toprovide for control signal redundancy, and backup in the event of afaulty backbone hybrid pixel driver chip 110B. For example, thestaggered arrangement of pixel driver chips 110 can include an oddpartition (e.g. upper chips), and an even partition (e.g. lower chips).The bus column 515 may include a partition of global signal linesincluding global hybrid driver configuration update 0/1 (614, 613),global data clock 0/1 (622, 621), global emission row synchronization0/1 (632, 631), global emission frame synchronization 0/1 (642,641),global emission clock red 0/1 (652, 651), and global emission clockblue/green 0/1 (662, 661). The backbone may additionally include one ormore backup hybrid pixel driver chips 700A, 770B. In an embodiment, theglobal hybrid driver configuration update 610 is input to backup hybridpixel driver chips 700A, with the global data clock 620 input to backuphybrid pixel driver chips 700B. The additional global signals 630, 640,650, 660 may be input to both backup hybrid pixel driver chips 700A,700B.

As illustrated in FIG. 7 , the backup hybrid pixel driver chips 700A,700B output manipulated backup signal lines 711, 712, 721, 722 to thepartitioned row 404 and row of hybrid pixel driver chips. Themanipulated backup signal lines 711, 712, 721, 722 may be connected toinputs of the backbone hybrid pixel driver chips configured forconfiguration update, data clock, frame synchronization, and rowsynchronization functions. In operation the backup hybrid pixel driverchips 700A, 700B use the token to initialize their multiplexer output(e.g. modified signal). Backup input pins are added to the backbonehybrid pixel driver chips configured for row function (configurationupdate, data clock, frame synchronization, row synchronization) to knowwhether any of the backup hybrid pixel driver chips 700A, 700B areactive, and provide the modified row function signals to the row. In theembodiment illustrated, the manipulated backup signal lines 711, 712,721, 722 are not input to the hybrid pixel driver chips configured foremission clock functions. In accordance with embodiments, the backuphybrid pixel driver chips 700A, 700B can be programmed as either an LEDdriving pixel driver chip, or to perform the function of a faultybackbone hybrid pixel driver chip within the same backbone row.

FIG. 8 is a routing diagram of emission frame synchronization andemission row synchronization buffering within rows of pixel driver chipsin accordance with an embodiment. As shown, the global emission rowsynchronization 630 and global emission frame synchronization 640, inaddition to optionally being partitioned as described above, may beseparated into multiple phases. Five phases Φ0-Φ4 are illustrated,though this is exemplary and embodiments are not limited to a specificnumber of phases. In the particular embodiment illustrated, each 5th rowshares the same phase.

FIG. 9 is a routing diagram of vertical signal redundancy and emissionclock vertical and horizontal buffering in accordance with anembodiment. As shown, the global emission clocks 650, 660, in additionto optionally being partitioned as described above, maybe separated intomultiple phases similar to the global emission row synchronization 630and global emission frame synchronization 640. The exemplary embodimentillustrated in FIG. 9 provides row partitioning with main/sparefunctions. For example, the odd partition (e.g. 1) may function as aspare, with the even partition (e.g. 0) functioning as the main. In thismanner, the backbone hybrid pixel driver chip 110B function may bedetermined by which odd/even chip in a row has the token. This may bedetermined by VST inputs, VST_0 612 (main) and VST_1 611 (spare). Asdescribed in more detail in the following description, the globalemission clocks 650, 660 are repeated by the backbone hybrid pixeldriver chips.

Referring now to FIG. 10 a routing diagram is provided of backbonerouting of global signal lines to rows of backbone hybrid pixel driverchips and row signal lines in accordance with an embodiment. Theexemplary layout provided in FIG. 10 combines several features inaccordance with embodiments. As shown, separate phases (Φ0, Φ1) ofglobal emission row synchronization 630 and global emission framesynchronization 640 signals are sent to different rows (N-1, N).Additionally, separate phases (Φ0, Φ1) of global emission clock red 650and global emission clock blue-green 660 signals are sent to differentrows (N-1, N). As shown, repeat emission clock red and emission clockblue/green signal lines 650R, 660R are output from the correspondingbackbone hybrid pixel driver chips to the next row (e.g. every 5th row).It is noted the particular connections for global signal lines 630, 640,650, 660 are different than previously described an illustrated, thougheither configuration is possible with combinations of embodiments.Specifically, the corresponding backbone hybrid pixel driver chipsconnected to the global signal lines 630, 640, 650, 660 are partitionedwith a pair in either the odd or even section, rather than one chip ineach odd and even section.

Still referring to FIG. 10 , global hybrid driver configuration update0/1 (614, 613) and global data clock 0/1 (622, 621) signal lines areinput to corresponding pairs of backbone hybrid pixel driver chips.Similarly, VST_0 612 and VST_1 611 signal lines are input to thebackbone hybrid pixel driver chips coupled to the global hybrid driverconfiguration update 0/1 (614, 613) inputs, and at one of each of thebackbone hybrid pixel driver chips coupled the global data clock 0/1(622, 621) signal lines. VST out 617 signal lines are output to both ofthe backbone hybrid pixel driver chips coupled the global data clock 0/1(622, 621) signal lines in the next row (N). VST out 617 signal linesare also repeat signal lines, which taken together will repeat VST_0 612and VST_1 611 signal lines to the next row.

With the particular configuration illustrated in FIG. 10 , the dataclock and hybrid pixel driver configuration update are separatelycreated for each row partition 0/1. In this particular illustration, thepartition of 0/1 corresponds to right/left as opposed to bottom/top(even/odd). In other embodiments, the partition 0/1 corresponds tobottom/top (even/odd) as previously described. Each hybrid pixel driverchip row buffers the emission clock red, emission clock blue/green,emission frame synchronization, and emission row synchronization for itsassociated clock phase. However, embodiments are not limited to thisparticular configuration, and each of the global signal lines may beseparately created for each row partition 0/1.

FIG. 11 is a routing diagram of horizontal control signal redundancy forVST and backup line connection in accordance with an embodiment. Amongthe select global signal lines included in FIG. 11 are VST scan clock682, and VST row capture clock 681, emission clock red_1 651 (spare),and emission clock green/blue_1 661 (spare). Thus, in this circumstance,the row partition 0/1 for the emission clock signal lines corresponds tomain/spare. As shown, the VST scan clock 682, VST row capture clock 681,as well as VST_0 612 and VST_1 611, are input to the backbone hybridpixel driver chips that produce the manipulated hybrid driverconfiguration update 610M, manipulated data clock 620M, manipulatedemission clock red 651M (or 650M generally), and manipulated emissionclock blue-green 661M (or 660M generally) signals, as well as into thespare backbone hybrid pixel driver chips 700A, 700B. The emission clockred_1 651 (spare), and emission clock green/blue_1 661 (spare) are inputto the backbone hybrid pixel driver chips that produce the manipulatedemission clock red 651M (or 650M generally), and manipulated emissionclock blue-green 661M (or 660M generally) signals, as well as into thespare backbone hybrid pixel driver chips 700A, 700B.

In particular embodiment illustrated, the spare backbone hybrid pixeldriver chip 700A outputs are connected to the backup indicator_0 618,and backup line_0 712 within row 404, while spare backbone hybrid pixeldriver chip 700B outputs are connected to the backup indicator_1 619,and backup line_0 711 within row 404. The backup indicators (e.g. 618,619) indicate that the backup lines (e.g. 712, 711) are valid to providebackup functions. Backup indicator_0 618 and backup line_0 712 are usedtogether, and backup indicator_0 619 and backup line_0 711 are usedtogether. In this manner, the spare backbone hybrid pixel driver chips700A, 700B can be programed to back up a faulty backbone hybrid pixeldriver chip originally designed to buffer the global emission clocksignals, and transmit the manipulated emission clock signals (e.g. 651,661 or 650, 660 generally) to the row 404 over the backup line_0 712 orbackup line_0 711.

FIG. 12 is a routing diagram of horizontal control signal redundancy forrow function signal connections in accordance with an embodiment.Row-function partitioning (or chip partitioning) within a hybrid pixeldriver chip backbone in accordance with embodiments entails receiving aglobal signal with one or more backbone hybrid pixel driver chips 110B,and transmitting a manipulated signal from the one or more backbonehybrid pixel driver chips 110B to one or more other backbone hybridpixel driver chips, and the associated group of LED driving pixel driverchips 110D within the corresponding row.

A specific global signal may be directly received by a plurality of thebackbone hybrid pixel driver chips 110B, while the manipulated signal isproduced by a specified backbone hybrid pixel driver chip 110B of theplurality, or alternatively by a spare backbone hybrid pixel driver chip700A, 700B. In the embodiment illustrated in FIG. 12 , the global hybriddriver configuration update 610 and global data clock 620 signal linesare input the respective backbone chips for which a manipulated signalis generated, as well as for the backbone chips that are programmed tomodify the global emission clocks (e.g. 650, 660), and spare chips (e.g.700A, 700B). Similarly, the global emission row synchronization 630 andglobal emission frame synchronization 640 signal lines are input to therespective backbone chips for which a manipulated signal is generated,as well as for the backbone chips that are programmed to modify theglobal emission clocks (e.g. 650, 660), and spare chips (e.g. 700A,700B). Additionally, as described with regard to FIG. 11 , the globalemission clock red 650 and global emission clock blue-green 660 signallines are input to the respective backbone chips for which a manipulatedsignal is generated, as well as for the spare chips (e.g. 700A, 700B).

In an embodiment, a display panel includes a bus column 515 of globalsignal lines, a plurality of rows 404 of row function signal lines, anda plurality of rows [1 . . . N] of pixel driver chips 110, each row ofpixel driver chips connected to a corresponding row 404 of row functionsignal lines, each pixel driver chip connected to a corresponding matrix102 of light emitting diodes (LEDs) 104. Each row of pixel driver chipscan include a group of backbone hybrid pixel driver chips 110B and agroup of LED driving pixel driver chips 110D. The bus column 515 ofglobal signal lines is coupled to the group of backbone hybrid pixeldriver chips 110B for each row of pixel driver chips and each separatebackbone hybrid pixel driver chip includes an input connected to acorresponding global signal line and an output (e.g. 1450M, FIG. 14 )connected to a corresponding row function signal line within acorresponding row of row function signal lines to transmit acorresponding manipulated signal to the corresponding row of pixeldriver chips.

The following exemplary implementation is directed to data clock andconfiguration update routing. In an embodiment, each group of backbonehybrid pixel driver chips 110B includes a data clock backbone hybridpixel driver chip with an input coupled with a global data clock 620signal line, and an output coupled with a corresponding row functionsignal line to transmit a manipulated data clock 620M signal to thecorresponding row of pixel driver chips. Each group of backbone hybridpixel driver chips may also include a configuration update backbonehybrid pixel driver chip with an input coupled with a globalconfiguration update 610 signal line, and an output coupled with acorresponding row function signal line to transmit a manipulatedconfiguration update 610M signal to the corresponding row of pixeldriver chips. In an embodiment, the data clock backbone hybrid pixeldriver chip includes an input coupled with the global configurationupdate 610 signal line, and the configuration update backbone hybridpixel driver chip includes an input coupled with the global data clock620 signal line.

The following exemplary implementation is directed to VST routing andbackup chips. In an embodiment, each group of backbone hybrid pixeldriver chips includes a backup backbone hybrid pixel driver chip 700A,700B, where the backup backbone hybrid pixel driver chip 700A, 700Bincludes an input coupled with the global configuration update 610signal line and an input coupled with the global data clock 620 signalline. A VST clock line (e.g. VST scan clock 682, VST row capture clock681) may be coupled to inputs of the data clock backbone hybrid pixeldriver chip, the configuration update backbone hybrid pixel driver chip,and the backup backbone hybrid pixel driver chip. The backup backbonehybrid pixel driver chip may also include an output coupled with acorresponding row function signal line to transmit a manipulated rowfunction signal to the corresponding row of pixel driver chips,including the data clock backbone hybrid pixel driver chip and theconfiguration update backbone hybrid pixel driver chip.

The following exemplary implementation covers another routing, such asthat for synchronization. In an embodiment, each group of backbonehybrid pixel driver chips includes a first backbone hybrid pixel driverchip with an input coupled with a first global signal line, and a firstoutput coupled with a corresponding first row function signal line totransmit a first manipulated signal to the corresponding row of pixeldriver chips, and a second backbone hybrid pixel driver chip with aninput coupled with a second global signal line, and a second outputcoupled with a corresponding second row function signal line to transmita second manipulated signal to the corresponding row of pixel driverchips. In an embodiment, the second row function signal line is coupledto a third input of the first backbone hybrid pixel driver chip, and thefirst row function signal line is coupled to a fourth input of thesecond backbone hybrid pixel driver chip. For example, the first globalsignal line may be a global emission row synchronization 630 line, andthe second global signal line may be a global emission framesynchronization 640 line.

The display panel may distribute global row function signals among thebackbone hybrid pixel driver chips so that each backbone hybrid pixeldriver chip is responsible for manipulating and/or repeating a specifiedglobal row function signal. In an embodiment, each group of backbonehybrid pixel driver chips includes a data clock backbone hybrid pixeldriver chip with an input coupled with a global data clock 620 signalline and a global configuration update 610 signal line, a configurationupdate backbone hybrid pixel driver chip with an input coupled with theglobal data clock signal 620 line and the global configuration update610 signal line, a frame synchronization backbone hybrid pixel driverchip with an input coupled with a global frame synchronization 630signal line, a row synchronization backbone hybrid pixel driver chipwith an input coupled with a global row synchronization 640 signal line,and an emission clock backbone hybrid pixel driver chip with an inputcoupled with a global emission clock (e.g. 650, 660) signal line. Eachgroup of backbone hybrid pixel driver chips may additionally include oneor more backup backbone hybrid pixel driver chips 700A, 700B coupledwith the global data clock 620 signal line, the global configurationupdate 610 signal line, the global frame synchronization 630 signalline, the global row synchronization signal 640 line, and the globalemission clock (e.g. 650, 660) signal line.

FIG. 13 is a routing diagram of global signal lines and row signal linesconnections to and from the backbone of a tile-based display panel inaccordance with an embodiment. In particular, the routing diagramillustrates global signal line inputs, and (manipulated) outputs fromodd/even indices of group of backbone hybrid pixel driver chips 110B toodd/even routing within a row 404 of row signal lines, as well as repeatoutputs to the next row. At a high level, FIG. 13 provides inputs forthe odd/even indices of a row of backbone hybrid pixel driver chips.Thus, annotation of 110B illustrates the entire backbone row of backbonehybrid pixel driver chips 110B. Taken together, FIG. 13 illustrates highlevel connections to a backbone row 1300 of odd/even indices of backbonehybrid pixel driver chips 110B. As shown, several global signals (whichmay be digital) are input to both odd/even groups of backbone hybridpixel driver chips including VST scan clock 682, VST row capture clock681, emission frame synchronization 640, and emission rowsynchronization 630. Additional signal lines, not previously discussedinclude a hybrid pixel driver chip reset 690, token reset 692, anddesign for test control 694 signal line. Global data clock_1 621, andglobal configuration update_1 613 signal lines are input to only the oddindices backbone hybrid pixel driver chips, while global data clock_0622 and global configuration update_0 614 are input to only the evenindices backbone hybrid pixel driver chips.

Additionally, data signals are input into each of the odd/even groups ofbackbone hybrid pixel driver chips including data 440, and configurationupdate 445 signal lines.

In addition, there are several vertically repeating global signals (e.g.digital) that are input to both odd/even groups of backbone hybrid pixeldriver chips including VST_0 (main) 612, VST_1 (spare) 611, emissionclock red_0 (main) 652, emission clock red_1 (spare) 651, emission clockblue-green_0 (main) 662, and emission clock blue-green_1 (spare) 661.Outputs from the odd/even indices of the backbone hybrid pixel driverchips 110B include repeat emission clock blue-green 662R, repeatemission clock red 652R, repeat emission clock blue-green 661R, repeatemission clock red 651R, and VST out 617.

In the embodiment, outputs from the odd indices of the backbone hybridpixel driver chips 110B include manipulated data clock_1 621M,manipulated configuration update_1 613M, manipulated emission framesynchronization_1 641M, manipulated emission row synchronization_1 631M,manipulated emission clock red_1 651M, manipulated emission clockblue-green_1 661M, backup line_1 711, and backup line_3 721.

In the embodiment, outputs from the even indices of the backbone hybridpixel driver chips 110B include manipulated data clock_0 622M,manipulated configuration update_0 614M, manipulated emission framesynchronization_0 642M, manipulated emission row synchronization_0 632M,manipulated emission clock red_0 652M, manipulated emission clockblue-green_0 662M, backup line_0 712, and backup line_2 722.

FIG. 14 is a block circuit diagram for a backbone hybrid pixel driverchip in accordance with an embodiment. In the embodiment illustrated,the backbone hybrid pixel driver chip includes a VST driver circuitry1410, a signal modulator circuitry 1430, multiplexer driver circuitry1440, and an LED driving circuitry 1460.

The LED driving circuitry 1460 portion provides emitting function forthe hybrid pixel driver chips and stores the pixel data andconfiguration data. The LED driving circuitry 1460 portion includes ashift register 1462, latches 1464, memory 1466, and emission clockcounter 1468. At least data 440 signals and internal data clock 6201 areinput to the shift register 1462, and at least internal emission clockred 6501 and internal emission clock blue-green 6601 are input to theemission clock counter 1468 to output emission pulses at output drivers116. However, prior to emitting, need to configure the hybrid pixeldriver chips for row function.

The VST driver circuitry 1410 determines whether this row is on or off,and provides VST propagation from top to bottom of the display panel.The actual token hybrid pixel driver chips receive the global VSTsignals, while other hybrid pixel driver chips receive VST signals fromthe backup hybrid pixel driver chips. As shown, the VST driver circuitry1410 includes inputs for the VST scan clock 682, VST row capture clock681, VST_0 612 and VST_1 611, and outputs for a token latch 1414 signaland token 1412 signal. The token latch 141, token 1412, VST_0 612, andVST_1 611 signals are input into a signal modulator 1430.

Specifically, the VST driver circuitry 1410 includes an OR gate 1470coupled to VST inputs 611, 612, and a plurality of flip-flop circuits1480 coupled to the VST clock inputs 681, 682 and an output 1771 fromthe OR gate, the plurality of flip-flop circuits 1480 including thetoken 1412 output and a token latch 1414 output. In operation, the ORgate 1470 outputs a HIGH output 1771 signal if one or both the inputs tothe gate are HIGH (1). If neither input is high, a LOW output (0)results. With regard to the flip-flop circuits 1480, when the VST clockinput (e.g. 681 or 682) is LOW, output is LOW. When the VST clock input(e.g. 681 or 682) is HIGH, the flip-flop circuit output is HIGH (1) ifthe data input is HIGH (1), and the output is LOW (0) if the data outputis LOW (0).

Specifically, the output of the OR gate 1470 is coupled to data inputsof flip-flop circuits 1480A, 1480C. One VST clock (e.g. VST scan clock682) is coupled to a clock input of flip-flop circuit 1480A. Another VSTclock (e.g. VST row capture clock 681) is coupled to a clock input offlip-flop circuits 1480C, 1480B. The data output from flip-flop circuit1480A is coupled to the data input for flip flop circuit 1480B, andanode from the data output from flip-flop circuit 1480A is also coupledto a multiplexer 1442 within the multiplexer driver circuitry 1440.Token 1412 is coupled to the data output of flip-flop circuit 1480C, andtoken latch 1414 is coupled to the data output of flip-flop circuit1480B.

If the VST driver circuitry 1410 outputs that the row is on, the signalmodulator circuitry 1430 selects whether to take the global row functionsignals or backup lines for any of the row functions. The token latch1414 and token 1412 are different phases, and in combination with VST_0612 and VST_1 611 tell whether to use either of the backup lines 711,712 for any of the row function signals 610, 620, 630, 640, 650, 660.Additionally, the signal modulator circuitry 1430 modifies the globalinput signals to manipulated signals specific to the particular row. Aplurality of multiplexers 1432 output internal (manipulated) rowfunction signals from the signal modulator 1430 to a multiplexer driver1440 and the LED driving circuit 1460. Included outputs may be internalconfiguration update 6101, internal data clock 6201, internal remissionrow synchronization 6301, internal emission frame synchronization 6401,internal emission clock red 6501, and internal emission clock blue-green6601.

The multiplexer driver circuitry 1440 includes two portions, namely arepeater portion 1440A and row function output portion 1440B. Outputsfrom the VST driver circuitry 1410 are input to a multiplexer 1442 ofthe repeater portion 1440A, followed by buffering with buffer 1444, tooutput VST_out 617. Internal emission clocks can also be input to themultiplexer 1442, to alternatively output repeat emission clock signalssuch as repeat emission clock red 650R (651R, 652R) or repeat emissionclock blue-green 660R (661R, 662R). Internal row function signals fromthe signal modulator circuitry 1430 are input into a multiplexer 1446 ofthe row function output portion 1440B, followed by buffering with buffer1448, to output a manipulated multiplexer output 1450M signal (which isa manipulated signal output or repeat signal output for the programmedbackbone hybrid pixel driver chip). Thus, the manipulated multiplexeroutput 1450M may be any of the manipulated output signals, or backupsignals previously described, and physically connected to a specifiedrow function line within row 404 depending upon signal. For example,referring to the exemplary embodiment illustrated in FIG. 13 , themanipulated multiplexer output 1450M may be connected to any of (621M,613M, 641M, 631M, 651M, 661M, 711, 721, 622M, 614M, 642M, 632M, 652M,662M, 712, 722) though other configurations are possible.

In accordance with embodiments, for non-backbone hybrid pixel driverchips VST input terminals 611 and 612 are still connected to the backupindicator signals in order to select the backup signal as one of rowfunction. The scan clock 681 and row capture clock 682 inputs may betied to ground to indicate they are not backbone hybrid drivers, whileVST out 617 and multiplexer out 1450M may be floating. Thus, circuitrymay remain the same for the backbone hybrid pixel driver chips 110B anddriving hybrid pixel driver chips 110A, with only programming andoutside connections being different.

In an embodiment, a hybrid pixel driver chip includes vertical selectiontoken (VST) inputs (e.g. 611, 612), VST clock inputs (e.g. 681, 682),and a VST driver circuitry 1410 coupled to the VST inputs and the VSTclock inputs, the VST driver circuitry further including a token 1412output and a token latch 1414 output. The hybrid pixel driver chipfurther includes a signal modulator circuitry 1430 coupled to the token1412 output and the token latch 1414 output, the signal modulatorcircuitry 1430 further including a plurality of multiplexers 1432coupled to a plurality of global signal inputs, and a plurality ofinternal signal outputs from the plurality of multiplexers 1432. Thesignal modulator circuitry 1430 may also be coupled to the VST inputs(e.g. 611, 612). Additional components of the hybrid pixel driver chipcan include a multiplexer driver circuitry 1440 including a multiplexer1446 coupled with the plurality of internal signal outputs, and amultiplexer output 1450M, and an LED driving circuitry 1460 coupled witha data 440 input and one or more of the plurality of internal signaloutputs, the LED driving circuitry 1460 additionally including aplurality of output drivers 116.

In an embodiment, the multiplexer driver circuitry 1440 includes arepeater portion 1440A coupled with the VST driver 1410 and a rowfunction output portion 1440B coupled with the signal modulator 1430.

In an embodiment, the VST driver circuitry 1410 includes an OR gate 1470coupled to VST inputs (e.g. 611, 612), and a plurality of flip-flopcircuits (1480A, 1480B, 1480C) coupled to the VST clock inputs (e.g. 681or 682) and an output 1471 from the OR gate 1470, the plurality offlip-flop circuits including the token 1412 output and a token latch1414 output.

FIG. 15 is a timing diagram for data loading of token activated hybridpixel driver chips in accordance with an embodiment. Thus, the timingdiagram of the embodiment in FIG. 15 is directed to the specificbackbone hybrid pixel driver chips that are wired to the VST routingbackbone (e.g. as illustrated in FIG. 11 ). Specifically, the timingdiagram of FIG. 15 is directed to the two left-most backbone hybridpixel driver chips illustrated in FIG. 11 with the global/repeat VSTconnections.

FIG. 15 illustrates a particular aspect of embodiments in which thespecific backbone hybrid pixel driver chips are programmed in two parts.Firstly, the specific backbone hybrid pixel driver chips are configured.Then the specific backbone hybrid pixel driver chips deliver thecorresponding multiplexer out 1450M signals, specifically themanipulated configuration update 610M and manipulated data clock 620signals to the other pixel driver chips connected to the correspondingrow 404. Once the row is configured, then the other data bits can bedefined. Thus, a method of programming a backbone hybrid pixel driverchip in an embodiment includes a general sequence of activating thetoken, once the token is high programming the data clock andconfiguration update so that this row is available (sending manipulateddata clock and manipulated configuration update to the rest of the row),followed by writing the rest of the configuration bits.

Three distinct portions of data 440 bits are illustrated in FIG. 15 .Token driver configuration 1510 data includes data for optionalselection of a backup line 711/712 with signal modulator 1430, and datafor manipulating the global data clock 620 and global configurationupdate 610 signals. This token driver configuration 1510 data is used byonly the token activated backbone hybrid pixel driver chips that arehardwired to the VST signal lines. Row driver configuration 1520 dataincludes data for selection of the other row function signals with thesignal modulator 1430, and LED configuration within the row. This rowdriver configuration 1520 data is used by all backbone hybrid pixeldriver chips to transmit manipulated row function signals to thecorresponding row 404. LED pixel data 1530 includes data for the LEDpixel data slices 0/1 of hybrid pixel driver chips within acorresponding row.

As shown in FIG. 15 , initially a token reset 692 signal goes high toreset the backbone hybrid pixel driver chip. Also, the VST row captureclock 681 goes high (leading edge), and the VST driver 1410 generatesthe high token 1412 signal. At this point, the backbone hybrid pixeldriver chip for row0 is token activated and prepared for configurationand data loading. However, prior to loading LED pixel data, the hybridpixel drivers are first configured. If VST is active at certain row, ittends to high (token). The token follows the global VST clocks (VST scanclock 682, VST row capture clock 681). In this embodiment, VST scanclock 682 and VST row capture clock 681 are the same frequency.

As described, configuration is performed in two parts. First, tokendriver configuration 1510 data is loaded to configure the specifichardwired backbone hybrid pixel driver chip with for multiplexerselection of backup lines 0/1 712, 711, and for generating themanipulated data clock 620M and manipulated configuration update 610Msignals. Backup line configuration is included because it can be usedfor either manipulated data clock 620M or manipulated configurationupdate 610M signal. The initial configuration is important because themanipulated data clock 620M and manipulated configuration update 610Msignals are needed to identify configuration bits or data bits. Second,row driver configuration 1520 is loaded for multiplexer selection of theother row function signals with multiplexer out 1450M. The particulartiming diagram of FIG. 15 is directed to two left-most backbone hybridpixel driver chips illustrated in FIG. 11 with the global/repeat VSTconnections. Thus, the multiplexer out 1450M signal lines correspond tothe manipulated data clock 620M and manipulated configuration update610M signals.

As shown, a pulse of the global configuration update 610 signal isapplied, and received by the hardwired backbone hybrid pixel driverchips. The corresponding internal data clock 6201 and internalconfiguration update 6101 are generated during application of the globalconfiguration update 610 signal, and the manipulated signals(manipulated data clock 620M signal and manipulated configuration update610M signal) are transmitted to the row through the multiplexer out1450M signal lines.

The global configuration update 610 signal is then de-asserted (fallingedge) which causes a configuration done 699 signal to go high. As alsoshown, a subsequent falling edge of the global configuration 610 signalcauses the configuration done 699 signal to go low. The configurationdone 699 signal is an internal signal that allows the hybrid pixeldriver chip to distinguish pixel data from configuration data, andtherefore write the LED pixel data 1530 to memory 1466. During row1time, the configuration done 699 signal prohibits configuring the driverwith data 1510, because the configuration bits from global data clock620 are used for the new row (rowe1) driver. The pixel bits in time row°and rowe1 are shared by both drivers in the two rows. Memory 1466 iswritten up by first few token driver configuration 1510 data bits, thengeneral row driver configuration 1520 data, and then pixel data 1530,following another set of pixel data in rowe1 time.

FIG. 16 is a flow chart for a method of programming a display tile fromreset in accordance with an embodiment. In interest of clarity,description of the method of FIG. 16 is made with reference to featuresfound in FIGS. 15, 14, and 11 . Generally, the programming sequence runsdown the backbone of the display tile, beginning with row i=0, andending with row i=N, with 0 being the first (top) row, and N being thelast (bottom) row of backbone hybrid pixel driver chips 110B.

The sequence may begin with row i=0, and the hybrid driver reset 690 andtoken reset 692 signals initially low. At operation 1610 the hybriddriver reset 690 and token reset 692 signals are asserted to high, andreleased to low. At operation 1620 the VST signals are propagated torow=<i>. At operation 1630 token driver configuration 1510 data isreceived by the token activated backbone hybrid pixel driver chips.Specifically, token driver configuration 1510 data is received bybackbone hybrid pixel driver chips in which the token 1412 signal ishigh. This may be attributed to the overlap of the VST row capture clock681 propagating to row <i> during a high token reset 692 signal. The VSTrow capture clock 681 is used to propagate the token signal row by row.When the token 1412 is high, the hybrid pixel driver chip is open toreceive data from data 440 lines. Also a reset signal is generated atthe beginning of token 1412 signal in order to reset the existing tokenstates in the activated hybrid pixel driver chip. At operation 1640 aglobal configuration update 610 pulse and row driver configuration 1520data are received by the backbone hybrid pixel driver chip, which thengenerates and sends the manipulated configuration update 610M signal tothe row of pixel driver chips 110. At operation 1650 the globalconfiguration update 610 pulse is de-asserted, and pixel data 1530 issent to all pixel driver chips 110 in the row through the columns ofdata 440 lines. At operation 1660 the process repeats for the next rowif <i> is not equal the number of rows N, and the process completes ifthis is the last row.

In an embodiment, a method of programming a display includes propagatingVST signals (e.g. any of 611, 612, 681, 682) to a row of pixel driverchips 110, receiving token driver configuration data 1510 with abackbone hybrid pixel driver chip 110B, receiving a global configurationupdate 610 pulse with the backbone hybrid pixel driver chip 110B,receiving row driver configuration data 1520 with the token activatedbackbone hybrid pixel driver chip 110B, and transmitting a manipulatedconfiguration update signal 610M from the backbone hybrid pixel driverchip 110B to the row (e.g. 1 . . . N) of pixel driver chips 110.

In an embodiment, a repeat VST signal 617 (e.g. 611, 612) is propagatedfrom the backbone hybrid pixel driver chip to a second backbone hybridpixel driver chip is a second row of pixel driver chips.

In an embodiment the method additionally includes asserting a tokenreset 692 signal and VST clock (e.g. 681 or 682) signal to the backbonehybrid pixel driver chip 110B to token activate the backbone hybridpixel driver chip prior to propagating the VST signals to the row ofpixel driver chips.

In utilizing the various aspects of the embodiments, it would becomeapparent to one skilled in the art that combinations or variations ofthe above embodiments are possible for forming a tile-based display withbackbone hybrid pixel driver chips. Although the embodiments have beendescribed in language specific to structural features and/ormethodological acts, it is to be understood that the appended claims arenot necessarily limited to the specific features or acts described. Thespecific features and acts disclosed are instead to be understood asembodiments of the claims useful for illustration.

What is claimed is:
 1. A display panel comprising: a display substrateincluding: an array of pixel driver chips; and a column of backbonehybrid pixel driver chips; wherein each backbone hybrid pixel driverchip is connected to a corresponding row of pixel driver chips withinthe array of pixel driver chips; and wherein each pixel driver chip andeach backbone hybrid pixel driver chip is connected to a correspondingmatrix of light emitting diodes (LEDs) to drive the corresponding matrixof LEDs.
 2. The display panel of claim 1, wherein the wherein each pixeldriver chip has a same internal circuitry as each backbone hybrid pixeldriver chip.
 3. The display panel of claim 2, further comprising a buscolumn of global signal lines coupled to the column of backbone hybridpixel driver chips.
 4. The display panel of claim 3, wherein eachbackbone hybrid pixel driver chip comprises an output coupled to a rowfunction signal line connected to the corresponding row of pixel driverchips.
 5. The display panel of claim 14, wherein the bus column ofglobal signal lines coupled to the column of backbone hybrid pixeldriver chips includes a plurality of global emission clock lines.
 6. Thedisplay panel of claim 5, wherein each backbone hybrid pixel driver chipcomprises a plurality of outputs coupled to a plurality of row functionsignal lines connected to the corresponding row of pixel driver chips.7. The display panel of claim 6, wherein the plurality of row functionsignal lines includes a plurality of manipulated emission clock signallines.
 8. The display panel of claim 1, further comprising a cut-outthrough the display substrate.
 9. The display panel of claim 8, furthercomprising a bus column of global signal lines coupled to the column ofbackbone hybrid pixel driver chips.
 10. The display panel of claim 9,wherein each backbone hybrid pixel driver chip comprises an outputcoupled to a row function signal line connected to the corresponding rowof pixel driver chips.
 11. The display panel of claim 10, comprising: afirst row function signal line above the cutout; a second row functionsignal line below the cutout; and a third row function signal lineadjacent the cutout, where the third row function signal line is shorterthan the first row function signal line and the second row functionsignal line.
 12. The display panel of claim 10, wherein each matrix ofLEDs is a passive matrix.
 13. The display panel of claim 12, whereineach LED is a micro LED with maximum dimension of less than 100 μm. 14.The display panel of claim 12, wherein each LED is a micro LED withmaximum dimension of less than 10 μm.
 15. The display panel of claim 10,wherein the bus column of global signal lines coupled to the column ofbackbone hybrid pixel driver chips includes a plurality of globalemission clock lines.
 16. The display panel of claim 15, wherein the buscolumn of global signal lines coupled to the column of backbone hybridpixel driver chips includes a global emission row synchronization line.17. The display panel of claim 15, wherein the bus column of globalsignal lines coupled to the column of backbone hybrid pixel driver chipsincludes a vertical selection token (VST) line.
 18. The display panel ofclaim 18, wherein each backbone hybrid pixel driver chip comprises aplurality of outputs coupled to a plurality of row function signal linesconnected to the corresponding row of pixel driver chips.
 19. Thedisplay panel of claim 18, wherein the plurality of row function signallines includes a manipulated emission clock signal line.
 20. The displaypanel of claim 18, wherein the plurality of row function signal linesincludes a plurality of manipulated emission clock signal lines.